By Mark I. Montrose
This available, new reference paintings exhibits how and why RF power is created inside a broadcast circuit board and the way within which propagation happens. With lucid causes, this e-book permits engineers to know either the basics of EMC conception and sign integrity and the mitigation technique had to hinder an EMC occasion. writer Montrose additionally exhibits the connection among time and frequency domain names that will help you meet crucial compliance requisites put on published circuit forums.
Using real-world examples the booklet features:
- Clear discussions, with out complicated mathematical research, of flux minimization concepts
- Extensive research of capacitor utilization for varied applications
- Detailed exam of elements features with numerous grounding methodologies, together with implementation techniques
- An in-depth learn of transmission line theory
- A cautious examine sign integrity, crosstalk, and termination
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Additional resources for EMC and the printed circuit board: design, theory, and layout made simple
The device shown is a totem-pole configuration. In reality, all logic device families exhibit similar ground bounce problems at high speeds of operation. When Switch 2 closes, the load capacitor C is shorted to ground. As the voltage acros5 C falls to OV, the stored charge flows back to ground, causing a masslve current surge within the ground return circuit. This current is identified as I,,,,,,,,,. 8 Lead inductance with~na component. As the capacitor's current is replenished with voltage and then discharged again.
R ~ . (*a1colnpone~tlicloser irr c;rh o l h ~ ror . ~nlenf :. ~~~~ Gnd Optimal 68 pin PQFP conf~gurat~on power and ground Chapter 3 . 5 length inductance also exists. Inductance is a component that generates RF currents. RF currents cause RF emissions. in addition to possibly causing signal integrity problems. Sometimes through-hole devices are installed on sockets. Sockets add greater lead-length inductance and hence create greater amounts of EM1 since the loop area is increased. Another design feature built into components that either promote or demote creation of RF currents is the manner in which IC package leads are bonded to the PCB.
For high-speed logic. higher frequency components will be present due to higher fundamental frequencies and shorter rise times (Chapter 3). 2. 'To minimize the u'istrihlrrion of R F currents, proper layout of PCB traces, component placement. and provisions to allow RF currents to retum to their source must be provided in an efficient manner to keep RF energy from being propagated throughout the structure (Chapter 1). 3. To minimize cfevelopment of c~on/morl-nlodt~ RF currents, proper decoupling of switching devices along with minimizing ground bounce and ground noise volt:ige within a plane structure inust exist (Chapter 5 ) .